MethodWhat is calculated?
The bridge signal grows in proportion to the excitation, but the heat generated in the gauge grows with its square. In a full bridge each gauge sees half the excitation, so P_DMS = U_B²/(4R). Whether the heat is removed depends on the power density referred to the grid area together with the object's thermal conductivity. Keil's example: 5 V on 120 Ω gives 52 mW and 21 mA per gauge, on 350 Ω only 18 mW and 7 mA.
Equations
P = U²/R (Keil Gl. 2.40)
P_DMS = U_B²/(4R) (Keil Gl. 2.41)
Leistungsdichte = P_DMS / (l_g · b_g)
U_B,max = √(4·R·p_zul·A)
ProcedureStep by step
- Enter grid dimensions and resistance from the datasheet.
- Choose the power-density guideline by material and type of measurement.
- Set the excitation so the power density stays below the guideline; reduce it markedly for plastics, wood or stacked rosettes.
Typical mistake
Applying the full excitation instead of U_B/2 to a single gauge, or confusing grid area with carrier area.
PracticeApplication and limits
Setting the amplifier excitation, choosing between 120 Ω and 350 Ω gauges and assessing warm-up behaviour (zero drift after switch-on).
Guidelines apply to well-bonded foil gauges on flat surfaces; stacked rosettes and quarter bridges with completion resistors inside the instrument need separate consideration.
SourceTechnical basis
Keil, Dehnungsmessstreifen, 2nd ed. 2017, sec. 2.8 electrical loading capacity, eqs. (2.39)–(2.41) and guidelines per [2.8.3].
The source supports the equation structure and worked examples; this calculator does not replace calibration of the measuring chain.
FAQFrequently asked questions
Why not simply use the highest excitation?
Warm-up error rises with the square of the excitation; creep and hysteresis increase and self-compensation can be disturbed.
Does the formula apply to carrier-frequency excitation?
Yes, using the RMS excitation; Keil found no difference in warm-up between DC and 1 kHz.
What does the adhesive change?
Hot-curing epoxies reduce the warm-up error to about 30 % compared with cold-curing adhesives.
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